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Chips and Cheese
Hot Chips 2026: Samsung and HBM Base Die Opportunities
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Telegraph
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(author: Chester Lam)
Telegraph
Hot Chips 2026: Samsung and HBM Base Die Opportunities
HBM, or High Bandwidth Memory, stacks multiple DRAM dies on top of a base die. The dies interface with each other via TSVs, while the base die talks with whatever compute die is using the memory via an interposer. Increasing bandwidth for a new HBM generation…
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